Resorting into outsourcing services has been practiced and is still highly considered in the semiconductor and electronics industry making the business become more mutually beneficial to both parties in terms of cost saving and uncompromised quality. We at Linearworks offer a wide range of post backend services using manual, semi-auto, and full-auto machines and equipment tested for quality throughput by major semiconductor. Our services include Tape and Reel, Visual Inspection, Laser Marking, Dry Baking, Open/Short Testing, X-Ray Inspection, CSAM Inspection and other Sub-assembly process.
TAPE AND REEL
Offers tube to tape, tube to tube, and dereeling (tape to tape, tape to tube) with an average output capacity of 210K/day catering wide range of IC packages from QFN, SOIC, MSOP, TSOP, QFP, etc.
Laser marking of different types of material (metal, plastic, paper, etc.) and Marking of top and bottom of IC packages using green, UV, fiber, or CO2 lasers according to customer’s requirement.
Can inspect in strip form or in singulated form using manual or automatic visual inspection equipment with a minimum capacity output of 300K/day
Four state programmable drying machines equipped with non-oxiding gas that removes moisture on the packages
2D, 3D, Wire Automatic X-ray Inspection. Can detect short, bridging, open, de-wet, void, wire sweep, broken wire, missing wire, misalign for BGA, Chip, QFN, QFP, and other packages.